Nuremberg Apr 25 - Apr 27, 2016

SMT Hybrid Packaging Nürnberg

The SMT Hybrid Packaging shows the complete spectrum on System Integration in Micro Electronics. This international meeting point in the field of electronic manufacturing offers the latest products, services and solutions. From Assembly, PCB, Soldering to Test - the complete market overview under one roof.


  • Assembly
  • Components
  • Design and development
  • Electronic manufacturing services (EMS)
  • Packaging  
  • PCB production
  • Screen printing
  • Soldering
  • and much more


For more information please click here.

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