SMT Hybrid Packaging takes a comprehensive view of system integration in microelectronics, from the initial idea and its development right through to the production of all technical processes during the manufacture of electronic assemblies.

Key themes: 

• Technologies and processes
• Materials and components
• Production
• Production equipment
• Reliability and testing
• Software and systems
• Services and consulting

More details about the event:

• Review: "SMT Hybrid Packaging 2017 - the film on the event"
• You can find the registration, tickets and overview of exhibitors on the organiser’s website

Event venue:
Messe Nürnberg

Please arrange an appointment with Ms Eva Apfel if you are interested in a personal meeting.