Nuremberg 07.05.2019 - 09.05.2019 SMTconnect 2019 SMT Hybrid Packaging becomes SMTconnect: the meeting place for the electronics manufacturing community

SMTconnect connects people and technologies from the areas of development, manufacturing, service and application of microelectronic assemblies and systems. It presents tailored solutions for electronic assemblies and systems, among other things.  The trade fair comprehensively covers the entire value chain and offers many opportunities for exchange as well as new impulses through a variety of further education and training opportunities and information about current trends.

Parallel to the trade fair, the SMTconnect Technology Days will focus on assembly and connection technologies in various application areas. The additional event includes seminars and special sessions on soldering, bonding and substrate technologies focused on practice.

Event venue:

Messezentrum Nürnberg

>> Please arrange an appointment with Ms Eva Apfel if you are interested in a personal meeting

>> You can find more information on the organiser’s website

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