Nuremberg 05.06.2018 - 07.06.2018 SMT Hybrid Packaging System Integration in Microelectronics

SMT Hybrid Packaging takes a comprehensive view of system integration in microelectronics, from the initial idea and its development right through to the production of all technical processes during the manufacture of electronic assemblies.


Key themes: 

  • Technologies and processes
  • Materials and components
  • Production
  • Production equipment
  • Reliability and testing
  • Software and systems
  • Services and consulting


More details about the event:


Event venue:
Messe Nürnberg


Please arrange an appointment with Ms Eva Apfel if you are interested in a personal meeting.

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