Nuremberg 16.05.2017 - 18.05.2017 SMT hybrid packaging Europe's leading event on System Integration in Micro Electronics

SMT Hybrid Packaging takes place in Nuremberg from May 16th to 18th, 2017. It is the only event in Europe which takes a comprehensive view of System intergration in microelectronics, from the initial idea and its development right through to the production of all technical processes during the manufacture of electronic assemblies.

More information on SMT Hybrid Packaging

If you are interested in expanding to Bavaria we will gladly make an appointment for an individual meeting at the fair.

Your contact:

Eva Apfel

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